Business News

Wokingham: EnSilica appoints new leaders and plans to recruit engineers

Published by
TBM Team

EnSilica, a leading independent provider of semiconductor solutions and IP, has appointed Mark Hodgkins as executive chairman to its board of directors and David Doyle as its new sales director.

Following a further year of increasing demand and continued growth, it is in addition planning an immediate recruitment drive for in excess of 12 additional engineering staff in the UK and 20 in India.  

Hodgkins has extensive experience of assisting technology based private companies in the achievement of their growth strategies in regard to executive execution, strategic advice, and fund-raising for development objectives.

Doyle has extensive worldwide experience in senior sales and executive positions at a variety of semiconductor companies, most recently Baolab Microsystems where he was CEO and, prior to that, ARC International plc where he was VP worldwide field operations.

Ian Lankshear, CEO of EnSilica, commented: “We are seeing high demand for ASIC developments with increased activity in the industrial, mobile and IoT markets. To meet the increasing demand and in terms of our continued growth objectives for 2016 and beyond, we need to invest significantly in more people. We are consequently looking for a variety of engineers to expand the staff at our facilities both in the UK and India, as well as making the key new appointments of executive chairman and sales director.”

Ian Lankshear (centre), EnSilica’s CEO, with David Doyle (left), Sales Director, and Mark Hodgkins (right, Executive Chairman
TBM Team

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