Chip maker EnSilica bags £10.4m funding from UK Space Agency
Oxfordshire-based chip maker EnSilica has been awarded £10.38 million over the next three years by the UK Space Agency.
The project will see the firm develop a family of semiconductor chips to support future generations of highly integrated, mass market satellite broadband user terminals.
These terminals will be capable of connecting with various satellite constellations – such as the EU’s planned multi-orbit constellation, IRIS2 – and will leverage advanced semiconductor technology.
It’s also set to provide a resilient and secure source of chips which is independent and not tied to specific satellite service operators.
The market potential for satellite user terminals is projected to reach $16.5 billion by 2031, with each terminal requiring hundreds of specialist chips to create an electronically steerable antenna – a clear opportunity for EnSilica.
This latest funding will enable the business to secure partners and customers to deliver and commercially exploit the project.
Ian Lankshear, CEO of EnSilica, said: “We’re honoured and proud to have won this highly significant award from the UK Space Agency.
“We believe satellite communications is an incredibly important sector for EnSilica and one that is fast expanding globally.
“This funding will enable us to advance our technology and bring innovative solutions to the satellite broadband market.
“The project is expected to be hugely beneficial to society, offering resilient internet connectivity in times of crisis, as well as providing high speed internet connectivity in remote communities not well served by terrestrial networks.
“We welcome the ongoing support from the UK Space Agency, which provides the framework for EnSilica to develop the technology required to address a market worth many hundreds of millions.”
